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1. Excellent solderability
2. Cheap/low cost
3. Allow long processing period
4. The industry uses a long-established / common surface treatment
5. Shelf life is at least 12 months
6. Multiple thermal deviations
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1. Differences in thickness/surface shape between large and small solder pads
2. Not suitable for SMD and BGA with pin pitch < 20 mil
3. Micro-spacing to form bridges
4. Not ideal for HDI products
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LF HASL – Lead Free Hot Air Solder Leveling
Usually thickness 1 – 40um
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1. Excellent solderability
2. Relatively cheap
3. Allow long processing period
4. The industry uses a long-established / common surface treatment
5. Shelf life is at least 12 months
6. Multiple thermal deviations
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1. There are differences in thickness/surface shape between large and small solder pads, but the degree of difference is lower than that of SnPb
2. High processing temperature, 260-270 degrees Celsius
3. Not suitable for SMD and BGA with pin pitch < 20 mil
4. Micro-spacing to form bridges
5. Not ideal for HDI products
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ENIG – Immersion Gold / Electroless Nickel Immersion Gold
Typical thickness 3 – 6 um (nickel) / 0.05 – 0.125 um (gold)
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1. Chemical immersion, excellent flatness
2. Suitable for fine pitch / BGA / smaller components
3. The process has been tested and inspected
4. Long shelf life
5. Wires can be glued
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1. Costly surface treatment
2. BGA has the problem of black pad
3. Aggressive to solder mask – especially with larger solder mask bridges
4. Avoid Soldermask-Defined BGAs
5. Do not plug holes on one side
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Immersion Tin
Typically thickness ≥ 1.0μm
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1. Chemical immersion, excellent flatness
2. Suitable for micro-pitch / BGA / smaller components
3. Belongs to the middle cost range of lead-free surface treatment
4. Suitable for crimp design
5. Good solderability after multiple thermal deviation treatments
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1. Very sensitive to handling - must wear gloves
2. The tin whisker problem
3. Aggressive to solder mask – solder mask bridge should be ≥ 5 mil
4. Baking before use may have adverse effects
5. Peelable glue is not recommended
6. Do not plug holes on one side
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Shen Yin
Typical thickness 0.12 – 0.40 um
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1. Chemical immersion, excellent flatness
2. Suitable for micro-pitch / BGA / smaller components
3. Belongs to the middle cost range of lead-free surface treatment
4. Can be reworked
5. Medium shelf life when properly packaged
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1. Very sensitive to handling / discoloration of silver surface / appearance problems - must wear gloves
2. Special packaging required - If the board is not used up after the package is opened, it must be resealed quickly.
3. Short processing time in the assembly stage
4. Peelable glue is not recommended
5. Do not plug holes on one side
6. Fewer suppliers offer this surface treatment
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OSP (Organic Solderable Protective Layer)
Typical thickness 0.20 – 0.65 um
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1. Excellent flatness
2. Suitable for micro-pitch / BGA / smaller components
3. Cheap/low cost
4. Can be reworked
5. Clean and environmentally friendly process
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1. Sensitive to handling - must use gloves and avoid scratching
2. Short processing time in the assembly stage
3. Limited thermal cycling, not the first choice for multiple welding processes (>2/3)
4. Limited shelf life - not suitable for certain shipping methods and long-term storage
5. Difficult to test
6. Cleaning of misprinted solder paste may adversely affect the OSP coating
7. Baking before use may have adverse effects
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